GRI

U.S. Department of Commerce Announces $1.4 Billion in Final Awards to Support the Next Generation of U.S. Semiconductor Advanced Packaging

News Manufacturing & Supply Chain General Updates
Date: 16th Jan, 2025 Source: US Department of Commerce Country: USA Original Source

Brief

On January 16, 2025, the US Department of Commerce issued an update regarding "U.S. Department of Commerce Announces $1.4 Billion in Final Awards to Support the Next Generation of U.S. Semiconductor Advanced Packaging". The CHIPS National Advanced Packaging Manufacturing Program (NAPMP) has finalized award funding for advanced packaging capabilities and research, bolstering the US semiconductor industry's competitiveness.

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US Department of Commerce

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